Ultra-thin power semiconductor wafers, cutting substrate resistance by half for over 15% power loss reduction, supporting diverse applications and its Powering AI roadmap, now available to customers.
Infineon Technologies has unveiled world’s thinnest 300-millimeter silicon power wafer. At just 20 micrometers thick—about a quarter of a human hair—these ultra-thin wafers mark a milestone in energy-efficient, high-density power solutions. This innovation represents a significant leap forward in the quest for optimized power management, especially critical for high-demand applications in AI data centers, consumer electronics, motor control, and computing.
The key features include:
- Ultra-thin wafer design cuts substrate resistance by 50%
- Reduces power loss by over 15% versus standard wafers
- Ideal for high-power AI servers needing voltage drops from 230V to below 1.8V
This technology enhances efficiency through vertical power delivery, ensuring a closer connection between the power source and processor. This efficiency boost is essential in supporting the soaring energy requirements of AI-driven data centers, making Infineon’s innovation a critical component in achieving sustainable digital transformation. To achieve this technological feat, Infineon engineers developed a pioneering grinding process to handle the unique challenges posed by the wafer’s ultra-thin structure. This enables seamless integration with Infineon’s existing silicon production lines, maintaining high yields and robust supply security.
Already qualified in the company’s Integrated Smart Power Stages for DC-DC converters, these ultra-thin wafers have shipped to key customers, underscoring the company’s eadership in advanced semiconductor manufacturing. With this new technology it anticipates a swift transition away from conventional wafer technology in low-voltage applications over the next few years, reinforcing its position as an industry leader in silicon, silicon carbide, and gallium nitride devices pivotal to a more sustainable and digital world.
Adam White, Division President of Power & Sensor Systems at Infineon, emphasizes the immense growth potential this technology holds for AI and power applications, estimating that the company’s AI-related business will reach a billion euros within two years. The advanced wafer technology aligns with Infineon’s strategic focus on decarbonization and digitalization, addressing the need for greener, more efficient power conversion as energy demand accelerates globally.
